Bewise Inc. www.tool-tool.com Reference source from the internet.
化 学镀镍层属于阴极性涂层,孔隙率是一个很重要 的质量指标,它不伏关系到镀层耐蚀性,还与其密度、韧性有关,化学镀镍耐蚀性好的原因之一就是它的低孔隙率。镀层愈厚孔隙率越小,与相同厚度的电镀镍层比 化学镀镍孔隙率要低得多。实验测得15微米厚的电镀镍、12微米厚的电镀铜层的孔隙率只相当于7微米的化学镀镍层。化学镀镍的孔隙率低的原因与其致密的非 晶或微晶结构有关。一般的酸性镀液厚度到15 微米就基本无孔。化学镀镍层最常见的是针孔形状的气孔,为了防止,除加表面活性剂外只有加强溶液的流动或工件与镀液间相对运动来解决。镀件上部的落尘面出 现的圆孔是细小悬浮粒子造成的。砂眼是指一直连通到基材的深孔,它与气孔的区别在于其具有不对称性,也不拖尾,产生原因是基材表面不合格(镀液中含有杂物 也会引起孔洞),还可能为光亮的化学镀层放大。另外一些颗粒状的瘤状物,周围有砂眼而误认为孔洞,其实是沉速快或其他固体粒子造成的。

  镀层表面孔隙率与以下因素有关:

  施镀工艺  通常碱性镀液的镀层要比酸性镀液的镀层孔隙率要大,用肼做还原剂得到的镀层比用次磷酸钠的高。添加剂种类也有影响,镀速快孔隙率增大,施镀过程中的杂质及悬浮物不仅增加表面粗糙度,同时也增加孔隙率;

  镀件表面粗糙度  镀件表面愈光洁平整其孔隙率愈小。喷砂表面一般要大于30微米的镀层才能做到无孔。厚度相同的镀层如分两次施镀也可以降低孔隙率,如某酸性镀液一次镀10微米厚孔隙率为4-5点/平方厘米,分两次镀则降代为1.9-2.5点/平方厘米;

  热处理有助于降低镀层的孔隙率   对钢和铝等基 材,化学镀镍是阴极性涂层,如果孔洞多将构成大阴极小阳极的腐蚀电池而加速基材的腐蚀。孔隙率作镀层质量检查时只做相对比较用,因为孔隙率测定方法不同结 果亦不同。镀层使用前最好根据工况先做试验为宜。孔隙率测定方法除贴婚法外,还有盐雾试验、不同浓度的二氧化硫试验均能得到可靠的结果。


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