公告版位
Bewise Inc. www.tool-tool.com Reference source from the internet.

A semiconductor is a solid material that has electrical conductivity in between that of a conductor and that of an insulator; it can vary over that wide range either permanently or dynamically.[1] Semiconductors are tremendously important in technology. Semiconductor devices, electronic components made of semiconductor materials, are essential in modern electrical devices. Examples range from computers to cellular phones to digital audio players. Silicon is used to create most semiconductors commercially, but dozens of other materials are used as well.

[edit] Overview

Semiconductors are very similar to insulators. The two categories of solids differ primarily in that insulators have larger band gapsenergies that electrons must acquire to be free to move from atom to atom. In semiconductors at room temperature, just as in insulators, very few electrons gain enough thermal energy to leap the band gap from the valence band to the conduction band, which is necessary for electrons to be available for electric current conduction. For this reason, pure semiconductors and insulators in the absence of applied electric fields, have roughly similar resistance. The smaller bandgaps of semiconductors, however, allow for other means besides temperature to control their electrical properties.

Semiconductors' intrinsic electrical properties are often permanently modified by introducing impurities by a process known as doping. Usually, it is sufficient to approximate that each impurity atom adds one electron or one "hole" (a concept to be discussed later) that may flow freely. Upon the addition of a sufficiently large proportion of impurity dopants, semiconductors will conduct electricity nearly as well as metals. Depending on the kind of impurity, a doped region of semiconductor can have more electrons or holes, and is named N-type or P-type semiconductor material, respectively. Junctions between regions of N- and P-type semiconductors create electric fields, which cause electrons and holes to be available to move away from them, and this effect is critical to semiconductor device operation. Also, a density difference in the amount of impurities produces a small electric field in the region which is used to accelerate non-equilibrium electrons or holes.

In addition to permanent modification through doping, the resistance of semiconductors is normally modified dynamically by applying electric fields. The ability to control resistance/conductivity in regions of semiconductor material dynamically through the application of electric fields is the feature that makes semiconductors useful. It has led to the development of a broad range of semiconductor devices, like transistors and diodes. Semiconductor devices that have dynamically controllable conductivity, such as transistors, are the building blocks of integrated circuits devices like the microprocessor. These "active" semiconductor devices (transistors) are combined with passive components implemented from semiconductor material such as capacitors and resistors, to produce complete electronic circuits.

In most semiconductors, when electrons lose enough energy to fall from the conduction band to the valence band (the energy levels above and below the band gap), they often emit light. This photoemission process underlies the light-emitting diode (LED) and the semiconductor laser, both of which are very important commercially. Conversely, semiconductor absorption of light in photodetectors excites electrons to move from the valence band to the higher energy conduction band, thus facilitating detection of light and vary with its intensity. This is useful for fiber optic communications, and providing the basis for energy from solar cells.

Semiconductors may be elemental materials such as silicon and germanium, or compound semiconductors such as gallium arsenide and indium phosphide, or alloys such as silicon germanium or aluminium gallium arsenide.

[edit] Band structure

For more details on this topic, see Electronic band structure.

There are three popular ways to describe the electronic structure of a crystal. The first starts from single atoms. An atom has discrete energy levels. When two atoms come close each energy level splits into an upper and a lower level, whereby they delocalize across the two atoms. With more atoms the number of levels increases, and groups of levels form bands. Semiconductors contain many bands. If there is a large distance between the highest occupied state and the lowest unoccupied space, then a gap will likely remain between occupied and unoccupied bands even after band formation.

A second way starts with free electrons waves. When fading in an electrostatic potential due to the cores, due to Bragg reflection some waves are reflected and cannot penetrate the bulk, that is a band gap opens. In this description it is not clear, while the number of electrons fills up exactly all states below the gap.

A third description starts with two atoms. The split states form a covalent bond where two electrons with spin up and spin down are mostly in between the two atoms. Adding more atoms now is supposed not to lead to splitting, but to more bonds. This is the way silicon is typically drawn. The band gap is now formed by lifting one electron from the lower electron level into the upper level. This level is known to be anti-bonding, but bulk silicon has not been seen to lose atoms as easy as electrons are wandering through it. Also this model is most unsuitable to explain how in graded hetero-junction the band gap can vary smoothly.

Like in other solids, the electrons in semiconductors can have energies only within certain bands (ie. ranges of levels of energy) between the energy of the ground state, corresponding to electrons tightly bound to the atomic nuclei of the material, and the free electron energy, which is the energy required for an electron to escape entirely from the material. The energy bands each correspond to a large number of discrete quantum states of the electrons, and most of the states with low energy (closer to the nucleus) are full, up to a particular band called the valence band. Semiconductors and insulators are distinguished from metals because the valence band in the semiconductor materials is very nearly full under usual operating conditions, thus causing more electrons to be available in the conduction band.

The ease with which electrons in a semiconductor can be excited from the valence band to the conduction band depends on the band gap between the bands, and it is the size of this energy bandgap that serves as an arbitrary dividing line (roughly 4 eV) between semiconductors and insulators.

In the picture of covalent bonds, an electron moves by hopping to a neighboring bond. Because of the Pauli exclusion principle it has to be lifted into the higher anti-bonding state of that bond. In the picture of delocalized states, for example in one dimension that is in a wire, for every energy there is a state with electrons flowing in one direction and one state for the electrons flowing in the other. For a net current to flow some more states for one direction then for the other direction have to be occupied and for this energy is needed. For a metal this can be a very small energy in the semiconductor the next higher states lie above the band gap. Often this is stated as: full bands do not contribute to the electrical conductivity. However, as the temperature of a semiconductor rises above absolute zero, there is more energy in the semiconductor to spend on lattice vibration and — more importantly for us — on lifting some electrons into an energy states of the conduction band, which is the band immediately above the valence band. The current-carrying electrons in the conduction band are known as "free electrons", although they are often simply called "electrons" if context allows this usage to be clear.

Electrons excited to the conduction band also leave behind electron holes, or unoccupied states in the valence band. Both the conduction band electrons and the valence band holes contribute to electrical conductivity. The holes themselves don't actually move, but a neighboring electron can move to fill the hole, leaving a hole at the place it has just come from, and in this way the holes appear to move, and the holes behave as if they were actual positively charged particles.

One covalent bond between neighboring atoms in the solid is ten times stronger than the binding of the single electron to the atom, so freeing the electron does not imply destruction of the crystal structure.

The notion of holes, which was introduced for semiconductors, can also be applied to metals, where the Fermi level lies within the conduction band. With most metals the Hall effect reveals electrons to be the charge carriers, but some metals have a mostly filled conduction band, and the Hall effect reveals positive charge carriers, which are not the ion-cores, but holes. Contrast this to some conductors like solutions of salts, or plasma. In the case of a metal, only a small amount of energy is needed for the electrons to find other unoccupied states to move into, and hence for current to flow. Sometimes even in this case it may be said that a hole was left behind, to explain why the electron does not fall back to lower energies: It cannot find a hole. In the end in both materials electron-phonon scattering and defects are the dominant causes for resistance.

Fermi-Dirac distribution. States with energy ε below the Fermi energy, here μ, have higher probability n to be occupied, and those above are less likely to be occupied. Smearing of the distribution increases with temperature.

Fermi-Dirac distribution. States with energy ε below the Fermi energy, here μ, have higher probability n to be occupied, and those above are less likely to be occupied. Smearing of the distribution increases with temperature.

The energy distribution of the electrons determines which of the states are filled and which are empty. This distribution is described by Fermi-Dirac statistics. The distribution is characterized by the temperature of the electrons, and the Fermi energy or Fermi level. Under absolute zero conditions the Fermi energy can be thought of as the energy up to which available electron states are occupied. At higher temperatures, the Fermi energy is the energy at which the probability of a state being occupied has fallen to 0.5.

The dependence of the electron energy distribution on temperature also explains why the conductivity of a semiconductor has a strong temperature dependency, as a semiconductor operating at lower temperatures will have fewer available free electrons and holes able to do the work.

[edit] Energy–momentum dispersion

In the preceding description an important fact is ignored for the sake of simplicity: the dispersion of the energy. The reason that the energies of the states are broadened into a band is that the energy depends on the value of the wave vector, or k-vector, of the electron. The k-vector, in quantum mechanics, is the representation of the momentum of a particle.

The dispersion relationship determines the effective mass, m * , of electrons or holes in the semiconductor, according to the formula:

 m^{*} = \hbar^2 \cdot \left[ {{d^2 E(k)} \over {d k^2}} \right]^{-1}

The effective mass is important as it affects many of the electrical properties of the semiconductor, such as the electron or hole mobility, which in turn influences the diffusivity of the charge carriers and the electrical conductivity of the semiconductor.

Typically the effective mass of electrons and holes are different. This affects the relative performance of p-channel and n-channel IGFETs, for example (Muller & Kamins 1986:427).

The top of the valence band and the bottom of the conduction band might not occur at that same value of k. Materials with this situation, such as silicon and germanium, are known as indirect bandgap materials. Materials in which the band extrema are aligned in k, for example gallium arsenide, are called direct bandgap semiconductors. Direct gap semiconductors are particularly important in optoelectronics because they are much more efficient as light emitters than indirect gap materials.

[edit] Carrier generation and recombination

For more details on this topic, see Carrier generation and recombination.

When ionizing radiation strikes a semiconductor, it may excite an electron out of its energy level and consequently leave a hole. This process is known as electron–hole pair generation. Electron-hole pairs are constantly generated from thermal energy as well, in the absence of any external energy source.

Electron-hole pairs are also apt to recombine. Conservation of energy demands that these recombination events, in which an electron loses an amount of energy larger than the band gap, be accompanied by the emission of thermal energy (in the form of phonons) or radiation (in the form of photons).

In the steady state, the generation and recombination of electron–hole pairs are in equipoise. The number of electron-hole pairs in the steady state at a given temperature is determined by quantum statistical mechanics. The precise quantum mechanical mechanisms of generation and recombination are governed by conservation of energy and conservation of momentum.

As the probability that electrons and holes meet together is proportional to the product of their amounts, the product is in steady state nearly constant at a given temperature, providing that there is no significant electric field (which might "flush" carriers of both types, or move them from neighbour regions containing more of them to meet together) or externally driven pair generation. The product is a function of the temperature, as the probability of getting enough thermal energy to produce a pair increases with temperature, being approximately 1/exp(band gap / kT), where k is Boltzmann's constant and T is absolute temperature.

The probability of meeting is increased by carrier traps – impurities or dislocations which can trap an electron or hole and hold it until a pair is completed. Such carrier traps are sometimes purposely added to reduce the time needed to reach the steady state.

[edit] Doping

For more details on this topic, see Doping (semiconductor).

The property of semiconductors that makes them most useful for constructing electronic devices is that their conductivity may easily be modified by introducing impurities into their crystal lattice. The process of adding controlled impurities to a semiconductor is known as doping. The amount of impurity, or dopant, added to an intrinsic (pure) semiconductor varies its level of conductivity. Doped semiconductors are often referred to as extrinsic.

[edit] Dopants

The materials chosen as suitable dopants depend on the atomic properties of both the dopant and the material to be doped. In general, dopants that produce the desired controlled changes are classified as either electron acceptors or donors. A donor atom that activates (that is, becomes incorporated into the crystal lattice) donates weakly-bound valence electrons to the material, creating excess negative charge carriers. These weakly-bound electrons can move about in the crystal lattice relatively freely and can facilitate conduction in the presence of an electric field. (The donor atoms introduce some states under, but very close to the conduction band edge. Electrons at these states can be easily excited to conduction band, becoming free electrons, at room temperature.) Conversely, an activated acceptor produces a hole. Semiconductors doped with donor impurities are called n-type, while those doped with acceptor impurities are known as p-type. The n and p type designations indicate which charge carrier acts as the material's majority carrier. The opposite carrier is called the minority carrier, which exists due to thermal excitation at a much lower concentration compared to the majority carrier.

For example, the pure semiconductor silicon has four valence electrons. In silicon, the most common dopants are IUPAC group 13 (commonly known as group III) and group 15 (commonly known as group V) elements. Group 13 elements all contain three valence electrons, causing them to function as acceptors when used to dope silicon. Group 15 elements have five valence electrons, which allows them to act as a donor. Therefore, a silicon crystal doped with boron creates a p-type semiconductor whereas one doped with phosphorus results in an n-type material.

[edit] Carrier concentration

The concentration of dopant introduced to an intrinsic semiconductor determines its concentration and indirectly affects many of its electrical properties. The most important factor that doping directly affects is the material's carrier concentration. In an intrinsic semiconductor under thermal equilibrium, the concentration of electrons and holes is equivalent. That is,

n = p = ni

Where n is the concentration of conducting electrons, p is the electron hole concentration, and ni is the material's intrinsic carrier concentration. Intrinsic carrier concentration varies between materials and is dependent on temperature. Silicon's ni, for example, is roughly 1.6×1010 cm-3 at 300 kelvin (room temperature).

In general, an increase in doping concentration affords an increase in conductivity due to the higher concentration of carriers available for conduction. Degenerately (very highly) doped semiconductors have conductivity levels comparable to metals and are often used in modern integrated circuits as a replacement for metal. Often superscript plus and minus symbols are used to denote relative doping concentration in semiconductors. For example, n + denotes an n-type semiconductor with a high, often degenerate, doping concentration. Similarly, p would indicate a very lightly doped p-type material. It is useful to note that even degenerate levels of doping imply low concentrations of impurities with respect to the base semiconductor. In crystalline intrinsic silicon, there are approximately 5×1022 atoms/cm³. Doping concentration for silicon semiconductors may range anywhere from 1013 cm-3 to 1018 cm-3. Doping concentration above about 1018 cm-3 is considered degenerate at room temperature. Degenerately doped silicon contains a proportion of impurity to silicon in the order of parts per thousand. This proportion may be reduced to parts per billion in very lightly doped silicon. Typical concentration values fall somewhere in this range and are tailored to produce the desired properties in the device that the semiconductor is intended for.

[edit] Effect on band structure

Band diagram of a p+n junction. The band bending is a result of the positioning of the Fermi levels in the p+ and n sides.

Band diagram of a p+n junction. The band bending is a result of the positioning of the Fermi levels in the p+ and n sides.

Doping a semiconductor crystal introduces allowed energy states within the band gap but very close to the energy band that corresponds with the dopant type. In other words, donor impurities create states near the conduction band while acceptors create states near the valence band. The gap between these energy states and the nearest energy band is usually referred to as dopant-site bonding energy or EB and is relatively small. For example, the EB for boron in silicon bulk is 0.045 eV, compared with silicon's band gap of about 1.12 eV. Because EB is so small, it takes little energy to ionize the dopant atoms and create free carriers in the conduction or valence bands. Usually the thermal energy available at room temperature is sufficient to ionize most of the dopant.

Dopants also have the important effect of shifting the material's Fermi level towards the energy band that corresponds with the dopant with the greatest concentration. Since the Fermi level must remain constant in a system in thermodynamic equilibrium, stacking layers of materials with different properties leads to many useful electrical properties. For example, the p-n junction's properties are due to the energy band bending that happens as a result of lining up the Fermi levels in contacting regions of p-type and n-type material.

This effect is shown in a band diagram. The band diagram typically indicates the variation in the valence band and conduction band edges versus some spatial dimension, often denoted x. The Fermi energy is also usually indicated in the diagram. Sometimes the intrinsic Fermi energy, Ei, which is the Fermi level in the absence of doping, is shown. These diagrams are useful in explaining the operation of many kinds of semiconductor devices.

[edit] Preparation of semiconductor materials

Semiconductors with predictable, reliable electronic properties are necessary for mass production. The level of chemical purity needed is extremely high because the presence of impurities even in very small proportions can have large effects on the properties of the material. A high degree of crystalline perfection is also required, since faults in crystal structure (such as dislocations, twins, and stacking faults) interfere with the semiconducting properties of the material. Crystalline faults are a major cause of defective semiconductor devices. The larger the crystal, the more difficult it is to achieve the necessary perfection. Current mass production processes use crystal ingots between four and twelve inches (300 mm) in diameter which are grown as cylinders and sliced into wafers.

Because of the required level of chemical purity and the perfection of the crystal structure which are needed to make semiconductor devices, special methods have been developed to produce the initial semiconductor material. A technique for achieving high purity includes growing the crystal using the Czochralski process. An additional step that can be used to further increase purity is known as zone refining. In zone refining, part of a solid crystal is melted. The impurities tend to concentrate in the melted region, while the desired material recrystalizes leaving the solid material more pure and with fewer crystalline faults.

In manufacturing semiconductor devices involving heterojunctions between different semiconductor materials, the lattice constant, which is the length of the repeating element of the crystal structure, is important for determining the compatibility of materials.

歡迎來到Bewise Inc.的世界,首先恭喜您來到這接受新的資訊讓產業更有競爭力,我們是提供專業刀具製造商,應對客戶高品質的刀具需求,我們可以協助客戶滿足您對產業的不同要求,我們有能力達到非常卓越的客戶需求品質,這是現有相關技術無法比擬的,我們成功的滿足了各行各業的要求,包括:精密HSS DIN切削刀具協助客戶設計刀具流程DIN or JIS 鎢鋼切削刀具設計NAS986 NAS965 NAS897 NAS937orNAS907 航太切削刀具,NAS航太刀具設計超高硬度的切削刀具BW捨棄式鑽石V卡刀BW捨棄式金屬圓鋸片木工捨棄式金屬圓鋸片PCD木工圓鋸片醫療配件刀具設計汽車業刀具設計電子產業鑽石刀具全鎢鋼V卡刀-電路版專用全鎢鋼鋸片焊刃式側銑刀焊刃式千鳥側銑刀焊刃式T型銑刀焊刃式千鳥T型銑刀焊刃式螺旋機械鉸刀全鎢鋼斜邊刀電路版專用鎢鋼焊刃式高速鉸刀超微粒鎢鋼機械鉸刀超微粒鎢鋼定點鑽焊刃式帶柄角度銑刀焊刃式螺旋立銑刀焊刃式帶柄倒角銑刀焊刃式角度銑刀焊刃式筒型平面銑刀


beeway 發表在 痞客邦 留言(0) 人氣()

Bewise Inc. www.tool-tool.com Reference source from the internet.
This article is about Volvo Car Corporation; For commercial vehicles see Volvo Group.
For other uses, see Volvo (disambiguation).
Volvo Car Corporation is the car maker using the Volvo trademark.
Volvo Personvagnar / Volvo Car Corporation
Type Subsidiary of Ford Motor Company
Founded 1927 by SKF
Assar Gabrielsson and Gustav Larson
Headquarters Flag of Sweden Gothenburg, Sweden
Key people Fredrik Arp, MD (CEO of Volvo Cars Corp.)
Steve Mattin (Design Director)
Ingrid Skogsmo (Safety Centre Director)
Industry Automotive
Products Luxury Cars, Engines
Revenue US$17.859 billion (2007)
Employees 24,384 (2007)
Website www.volvocars.com

Volvo Cars, or Volvo Personvagnar, is a Swedish automobile maker founded in 1927 in the city of Gothenburg in Sweden.

The name Volvo, derived from the Latin for "I roll," was thought to be a good trademark for a ball bearing as well as for an automobile.

Volvo was originally formed as a subsidiary company to the ball bearing maker SKF. It was not until 1935 when Volvo AB was introduced on the Swedish stock exchange that SKF sold most of the shares in the company. Volvo Cars was owned by AB Volvo until 1999, when it was acquired by the Ford Motor Company as part of its Premier Automotive Group along with Jaguar, Land Rover and Aston Martin.

Volvo produces models ranging from SUVs, wagons, and sedans to compact executive sedans and coupes. It competes directly with luxury car manufacturers such as Acura, Alfa Romeo, Audi, BMW, Cadillac, Infiniti, Lancia, Lexus, Mercedes-Benz, Volkswagen and Saab. With 2,500 dealerships worldwide in 100 markets; 60 percent of sales come from Europe, 30 percent from North America, and the other 10 percent is from the rest of the world.

Volvo's market share is shrinking in the North American market. However, Volvo increased its market share in new markets such as Russia, China and India[citation needed]. Specifically, Volvo expected sales in Russia to double and exceed 20,000 units by the end of 2007, making Russia one of the ten biggest markets for the company. Volvo already boasts the leading position in Russia's luxury car segment.[1]

Older models were often compared to tractors[citation needed], partially because Volvo AB was and still is a manufacturer of heavy equipment, earlier Bolinder-Munktell, now Volvo Construction Equipment. Considered by some to be slow and heavy,[2] they earned the distinction "brick"[3] as term of endearment for the classic, block-shaped Volvo. With the more powerful turbo charged variants known as "turbobricks".[3] More recent models have moved away from the boxy styles favored in the 1970s and 1980s and built a reputation for sporting performance. But not before the phenomenal success of factory supported Volvo 240 turbos winning both the 1985 European Touring Car Championship (ETC) & 1986 Australian Touring Car Championship (ATCC).[4] Most recently a 850 series wagon won top honors at the 1995 British Touring Car Championship (BTCC).

Owners are often proud of achieving prodigious mileages[5] with one well documented 1965 Volvo P1800S having been driven over 2.6 million miles.[6] According to some figures the average age of a Volvo being discarded is second only to Mercedes at 19.8 years.[7] Reliability is considered better than average[8] and in the USA Volvo dealers are listed by Forbes as one of the best among all car makers (9th)[9] and luxury car makers (6th).[10]

[edit] History

Gustav Larson and Assar Gabrielsson

Gustav Larson and Assar Gabrielsson
Volvo logotype (PRV-registr.) 1927.

Volvo logotype (PRV-registr.) 1927.
Volvo ÖV4 Touring 1927

Volvo ÖV4 Touring 1927
Volvo PV4 4-Door Sedan 1927

Volvo PV4 4-Door Sedan 1927

Volvo company came about in Gothenburg, Sweden in the year 1927. The company was founded by SKF as a subsidiary company 100% owned by SKF. Assar Gabrielsson was appointed the managing director and Gustav Larson as the technical manager.

"Cars are driven by people. The guiding principle behind everything we make at Volvo, therefore, is and must remain, safety", Assar Gabrielsson and Gustav Larson 1927.

Despite this, Volvo's originally had a reputation for high death rates in the event of an accident[citation needed]. This led to a drastic overhaul of Volvo's safety approaches and an aggressive marketing campaign to brand the cars as 'the safest on the road'. This perception branding has been so successful that "safety" is now the first word most associate with Volvo.[citation needed]

The trademark Volvo was first registered by SKF the 11th May 1915 with the intention to use it for a special series of ball bearing for the American market, but it was never used for this purpose. SKF trademark as it looks today was used instead for all the SKF-products. Some pre-series of Volvo-bearings stamped with the brand name 'Volvo' were manufactured but was never released to the market and it was not until 1927 that the trademark was used again, now as a trademark and company name for an automobile. The first Volvo car left the assembly line April 14, 1927 was called Volvo ÖV 4. After this the young company produced closed top and cabriolet vehicles, which were designed to hold strong in the Swedish climate and terrain. The Volvo symbol is an ancient chemistry sign for iron. The iron sign is used to symbolize the strength of iron used in the car as Sweden is known for its quality iron. The diagonal line (a strip of metal) across the grille came about to hold the actual symbol, a circle with an arrow, in front of the radiator. In the registration application for Volvo logotype in 1927, they simply made a copy of the entire radiator for ÖV4, viewed from the front.

In 1964 Volvo opened its Torslanda plant in Sweden, which currently is the one of its largest production sites (chiefly large cars and SUV). Then in 1965 the Ghent, Belgium plant was opened, which is the company's second largest production site (chiefly small cars). Finally in 1989 the Uddevalla plant in Sweden was opened, which is now jointly operated by Volvo Car Corporation and Pininfarina of Italy.

A collection of Volvo's most important historical vehicles are now housed a The Volvo Museum, which opened in a permanent location in Arendal at Hisingen on May 30, 1995.[11] For several years, the collection had been housed at "The Blue Hangar," at the then closed Torslanda Airport. [11]

Volvo 850 estate
Volvo 850 estate
2002 Volvo S80

2002 Volvo S80

[edit] Safety

Volvo cars have always evoked a reputation for solidity and reliability.[12]

In 1944, laminated glass was introduced in the PV model.[13] In 1958, Volvo engineer Nils Bohlin invented and patented the modern 3-Point Safety Belt, which became standard on all Volvo cars in 1959.[14] Volvo was the first company to produce cars with padded dashboards starting in late 1956 with their Amazon model.[citation needed] Additionally, Volvo developed the first rear-facing child seat in 1964[13] and introduced its own booster seat in 1978.[13] In 1986, Volvo introduced the first central high-mounted stoplight[13] (a brake light not shared with the rear tail lights), which became federally mandated in the United States in the 1986 model year. Seat belt and child seat innovation continued as shown in the 1991 960. The 960 introduced the first three-point seat belt for the middle of the rear seat and a child safety cushion integrated in the middle armrest.[13] Also in 1991 came the introduction of the Side Impact Protection System (SIPS) on the 940/960 and 850 models, which channeled the force of a side impact away from the doors and into the safety cage.[15] To add to its SIPS in 1995 Volvo was the first to introduce side airbags and installed them as standard equipment in all models in 1995. In 1998 Volvo also developed and was the first to install a head protecting airbag, which was made standard in all new models as well as some existing models. The head-protecting airbag was not available on the 1996 C70 due to the initial design deploying the airbag from the roof; the C70, being a convertible, could not accommodate such an airbag. Later years of the C70 featured a head-protecting airbag deploying upwards from the door, negating the issue of roof position. It has been stated by many testing authorities that side head protecting curtain airbags can reduce risk of death in a side impact by up to 40% and brain injury by up to 55%, as well as protecting in a rollover situation.[16] In 1998, Volvo introduced its Whiplash Protection System (WHIPS), a safety device to prevent injury of front seat users during collisions.[13] In 2004, Volvo introduced the BLIS system, which detects vehicles entering the Volvo's blind spot with a side view mirror mounted sensor and alerts the driver with a light. That year also saw Volvos sold in all markets equipped with side-marker lights and daytime-running lights (the latter having already been available in many markets for some time). Much of Volvo's safety technology now also goes into other Ford vehicles. In 2005 Volvo presented the second generation of Volvo C70, it comes with extra stiff door-mounted inflatable side curtains (the first of its kind in a convertible)[citation needed]. In 2006 Volvo's Personal Car Communicator (PCC) remote control has been launched as an optional feature with the all new Volvo S80. This feature is fairly new to the automotive industry. Before a driver gets to their car, they are able to review the security level and know whether they have set the alarm and if the car is locked.[citation needed] Additionally, there is a heartbeat sensor that warns if someone is hiding inside the car. The heartbeat sensor is rumored to also work with the SOS feature of Volvo's new telematics system.[citation needed] The all new Volvo S80 is also the first Volvo model to feature Adaptive cruise control (ACC) with Collision Warning and Brake Support (CWBS).[citation needed]

By the mid-1990s there was little to distinguish Volvo from some other manufacturers (notably Renault) on safety when put through standardized tests such as EuroNCAP. A 2005 FOLKSAM report[17] puts the 740/940 (from 1982 on) in the 15% better than average category, the second from the top category. Also, the production of P1800 had to be stopped because it did not fulfill US safety standards. The Volvo 745 was also recalled due to that the front seatbelts mounts could break in a collision.[18]

Since 2004 all Volvo models except for the C70 and C30 are available with an all wheel drive system developed by Haldex of Sweden.[19]

Even although Volvo Car Corp is owned by the Ford Motor Company, the safety systems of Volvo are still made standard on all of their vehicles. Volvo has patented all of their safety innovations that would include SIPS, WHIPS, ROPS, DSTC, IC, and body structures to name a few. Some of these systems have shown up in other Ford vehicles in related forms to that of Volvo systems only because Volvo has licenced the FOMOCO and other PAG members to utilize these features.[citation needed]

[edit] Safety reputation under question

According to Russ Rader, a spokesman for the Insurance Institute for Highway Safety, Volvo is lagging behind its competitors.[20] Dan Johnston, a Volvo spokesman, denied that the company's vehicles are any less safe than the Institute's top-rated vehicles, adding that

"It's just a philosophy on safety that is different from building cars to pass these kinds of tests."[21]

According to the IIHS, in recent years Volvo Cars have still managed to maintain their high class safety ratings as seen in test results.[22]. The Volvo XC90[23], S80[24], and C70[25] all score top scores in these rated crash tests.

In 2008 a French court found Volvo guilty of causing the death of two children and serious injuries of one in Wasselonne on June 17, 1999 when the brakes of a 1996 Volvo 850 failed. The prosecutor found Volvo partially responsible for the accident and sentenced Volvo to a 200 000 Euro fine.[26][12][27][28]

[edit] Safety milestones

[[Image:Volvo-122-coupe-1.jpg|thumb|The Amazon was noted for its safety features, with a padded dashboard, front and rear seat belts and a laminated windscreen.

歡迎來到Bewise Inc.的世界,首先恭喜您來到這接受新的資訊讓產業更有競爭力,我們是提供專業刀具製造商,應對客戶高品質的刀具需求,我們可以協助客戶滿足您對產業的不同要求,我們有能力達到非常卓越的客戶需求品質,這是現有相關技術無法比擬的,我們成功的滿足了各行各業的要求,包括:精密HSS DIN切削刀具協助客戶設計刀具流程DIN or JIS 鎢鋼切削刀具設計NAS986 NAS965 NAS897 NAS937orNAS907 航太切削刀具,NAS航太刀具設計超高硬度的切削刀具BW捨棄式鑽石V卡刀BW捨棄式金屬圓鋸片木工捨棄式金屬圓鋸片PCD木工圓鋸片醫療配件刀具設計汽車業刀具設計電子產業鑽石刀具全鎢鋼V卡刀-電路版專用全鎢鋼鋸片焊刃式側銑刀焊刃式千鳥側銑刀焊刃式T型銑刀焊刃式千鳥T型銑刀焊刃式螺旋機械鉸刀全鎢鋼斜邊刀電路版專用鎢鋼焊刃式高速鉸刀超微粒鎢鋼機械鉸刀超微粒鎢鋼定點鑽焊刃式帶柄角度銑刀焊刃式螺旋立銑刀焊刃式帶柄倒角銑刀焊刃式角度銑刀焊刃式筒型平面銑刀木工產業鑽石刀具等等。我們的產品涵蓋了從民生刀具到工業級的刀具設計;從微細刀具到大型刀具;從小型生產到大型量產;全自動整合;我們的技術可提供您連續生產的效能,我們整體的服務及卓越的技術,恭迎您親自體驗!!

BW Bewise Inc. Willy Chen willy@tool-tool.com bw@tool-tool.com www.tool-tool.com skype:willy_chen_bw mobile:0937-618-190 Head &Administration Office No.13,Shiang Shang 2nd St., West Chiu Taichung,Taiwan 40356 http://www.tool-tool..com / FAX:+886 4 2471 4839 N.Branch 5F,No.460,Fu Shin North Rd.,Taipei,Taiwan S.Branch No.24,Sec.1,Chia Pu East Rd.,Taipao City,Chiayi Hsien,Taiwan

Welcome to BW tool world! We are an experienced tool maker specialized in cutting tools. We focus on what you need and endeavor to research the best cutter to satisfy users demand. Our customers involve wide range of industries, like mold & die, aerospace, electronic, machinery, etc. We are professional expert in cutting field. We would like to solve every problem from you. Please feel free to contact us, its our pleasure to serve for you. BW product including: cutting toolaerospace tool .HSS DIN Cutting toolCarbide end millsCarbide cutting toolNAS Cutting toolNAS986 NAS965 NAS897 NAS937orNAS907 Cutting Tools,Carbide end milldisc milling cutter,Aerospace cutting toolhss drillФрезерыCarbide drillHigh speed steelMilling cutterCVDD(Chemical Vapor Deposition Diamond )’PCBN (Polycrystalline Cubic Boron Nitride) Core drillTapered end millsCVD Diamond Tools Inserts’PCD Edge-Beveling Cutter(Golden FingerEdge modifying knifeSolid carbide saw blade-V typeV-type locking-special use for PC boardMetal Slitting Sawa

beeway 發表在 痞客邦 留言(0) 人氣()

Bewise Inc. www.tool-tool.com Reference source from the internet.
General Motors Corporation
Type Public (NYSE: GM)
Founded 1908
Founder William C. Durant
Headquarters Detroit, Michigan, USA
Key people Rick Wagoner, chairman and CEO
Robert Lutz, vice chairman
Frederick Henderson, President and chief operating officer
Ray Young, CFO
Industry Automotive
Products Automobiles
Engines
Financial services
Revenue [1]US$181 billion(2007)[2][3][4][5]
Net income -$38.7 billion (2007)[6]
Employees 284,000 (2007)[7]
Website http://www.gm.com

General Motors Corporation, also known as GM, is a multinational corporation founded in 1908, and is headquartered in the United States. GM is the world's largest automaker and has been the global industry sales leader in each of the last 77 calendar years, although Toyota recorded higher sales figures in the first quarter of 2008.[8] General Motors, today employs about 284,000 people around the world. It manufactures its cars and trucks in 35 different countries and sells them under the brands of Buick, Cadillac, Chevrolet, GM Daewoo, GMC, Holden, Hummer, Opel, Pontiac, Saab, Saturn and Vauxhall.[9] As of 2007, General Motors is the fifth largest company in the world (behind Wal-Mart, Exxon Mobil, Royal Dutch Shell, and BP, ranked by revenue on the Fortune Global 500 list.)[10]

[edit] Company overview

General Motors was founded 1908, in Flint, Michigan and currently employs approximately 284,000 people around the world. GM's global headquarters is the Renaissance Center located in Detroit, Michigan, USA, They currently manufacture their cars and trucks in 35 different countries. Its European headquarters are based in Zurich, Switzerland, and its Holden headquarters are located in Melbourne, Victoria, Australia. In 2007, 9.37 million GM cars and trucks were produced globally under the following 12 brands: Buick, Cadillac, Chevrolet, GM Daewoo, GMC, Holden, Hummer, Opel, Pontiac, Saab, Saturn and Vauxhall. GM is also the majority shareholder in GM Daewoo Auto & Technology Co. of South Korea and has had many collaborations with the world's various automakers. This includes product, powertrain and purchasing collaborations with Suzuki Motor Corp. and Isuzu Motors Ltd. of Japan, advanced technology collaborations with Toyota Corporation and DaimlerChrysler AG and BMW AG of Germany and vehicle manufacturing ventures with several of the world's automakers including Toyota, Suzuki, Shanghai Automotive Industry Corp. of China, AvtoVAZ of Russia, Renault SA of France, and most recently, UzAvtosanoa of Uzbekistan. GM also had collaborations with Fiat S.p.A (see GM/Fiat Premium platform) and Ford Motor Company. To this day, GM retains various stakes in many different automakers.

GM parts and accessories are sold under GM Performance Parts, GM Goodwrench and ACDelco brands through GM Service and Parts Operations which supplies GM dealerships and distributors worldwide. GM engines and transmissions are marketed through GM Powertrain. GM's largest national market is the United States, followed by China, Canada, the United Kingdom, and Germany. GM owns nearly-half (49%) of the finance company GMAC Financial Services, which offers automotive, residential and commercial financing and insurance. GM's OnStar subsidiary is a vehicle safety, security and information service provider.

There have only been a limited number of models bearing the General Motors brand. The GM EV1 was an electric vehicle that was offered for lease only in the 1990s, before being unceremoniously scrapped. The Holden Statesman (1971 - 1985) was originally marketed as the General Motors statesman.

[edit] History

General Motors (GM) was founded on September 16, 1908 in Flint, Michigan, as a holding company for Buick, then controlled by William C. Durant, and acquired Oldsmobile later that year. The next year, Durant brought in Cadillac, Elmore, Oakland (later known as Pontiac) and several others. In 1909, General Motors acquired the Reliance Motor Truck Company of Owosso, Michigan, and the Rapid Motor Vehicle Company of Pontiac, Michigan, the predecessors of GMC Truck. Durant lost control of GM in 1910 to a bankers' trust, because of the large amount of debt taken on in its acquisitions coupled with a collapse in new vehicle sales. A few years later, Durant would start the Chevrolet Motor car company and through this he secretly purchased a controlling interest in GM. Durant took back control of the company after one of the most dramatic proxy wars in American business history. Shortly after, he again lost control for good after the new vehicle market collapsed. Alfred Sloan was picked to take charge of the corporation and led it to its post war global dominance. This unprecedented growth of GM would last through the late 70's and into the early 80's.

The General Motors Aftermarket Business in the US manages four brands; Goodwrench, ACDelco, GM Performance Parts and GM Accessories. GM Aftersales operates globally.

[edit] Corporate governance

The Renaissance Center in Detroit, Michigan, is General Motors' world headquarters

The Renaissance Center in Detroit, Michigan, is General Motors' world headquarters

Current members of the board of Directors of General Motors are: Percy Barnevik, Erskine Bowles, John Bryan, Armando Codina, Erroll Davis, George Fisher, Mark Guildenstern, Karen Katen, Kent Kresa, Ellen Kullman, Philip Laskawy, Kathryn V. Marinello, Eckhard Pfeiffer, and Rick Wagoner who also serves as chairman of the board.

[edit] Corporate structure

General Motors is structured into the following groups:

  • GMAP - Asia-Pacific
  • GME - Europe
  • GM LAAM - Latin America, Africa and the Middle East
  • GMNA - North America
  • GMAC Finance and insurance services
  • SPO Service, Parts and Operations
  • Other Operations

[edit] Online

The domain gm.com attracted at least 7 million visitors annually by 2008 according to a Compete.com survey.

[edit] Human resources

UAW-GM Center for Human Resources in Detroit.

UAW-GM Center for Human Resources in Detroit.

General Motors was named one of the "100 Best Companies for Working Mothers" in 2004 by Working Mothers magazine. GM has also given millions of dollars in computers to colleges of Engineering through its PACE Awards program.[11] Together with the United Auto Workers, GM created a joint venture dedicated to the quality of life needs of employees in 1985. The UAW-GM Center for human resources in Detroit is dedicated to providing GM salaried employees and GM UAW members programs and services related to medical care, diversity issues, education, training and tuition assistance, as well as programs related to work and family concerns, in addition to the traditional union-employer health and safety partnership.[12]

[edit] Marketing in the United States

At one time, each of GM's automotive divisions in the United States were targeted to specific market segments and despite some shared components, each distinguished itself from its stablemates with unique styling and technology. The shared components and common corporate management created substantial economies of scale, while the distinctions between the divisions created an orderly upgrade path, with an entry-level buyer starting out with a practical and economical Chevrolet and moving through offerings of the different divisions until the purchase of a Buick or Cadillac.

The postwar automobile industry became enamoured with the concept of "planned obsolescence", implemented by both technical and styling innovations with a typical 3-year product cycle. In this cycle, a new basic body shell is introduced and then modified for the next two years with minor styling changes. GM, Ford, and Chrysler competed vigorously in this new restyling environment.

[edit] Distinguishing the brands

By 1958, the divisional distinctions within GM began to blur with the availability of high-performance engines in Chevrolets and Pontiacs. The introduction of higher trim models such as the Chevrolet Impala and Pontiac Bonneville priced in line with some Oldsmobile and Buick offerings was also confusing to consumers. By the time Pontiac, Oldsmobile and Buick introduced similarly styled and priced compact models in 1961, the old "step-up" structure between the divisions was nearly over.

[edit] Compacts arrive

The decade of the 1960s saw the creation of compact and intermediate classes. The Chevrolet Corvair was a 6-cylinder answer to the Volkswagen Beetle, the Chevy II was created to match Ford's conventional Falcon and the Chevrolet Camaro/Pontiac Firebird was GMs counter measure to the Ford Mustang. Among intermediates, the Oldsmobile Cutlass nameplate became so popular during the 1970s that Oldsmobile applied the Cutlass name to most of its products in the 1980s. By the mid 1960s, most of GM's vehicles were built on a few common platforms and in the 1970s GM began to use nearly identical body panel stampings, differing only in internal and external trim items.

The 1971 Chevrolet Vega was GM's launch into the new subcompact class. Problems associated with its innovative aluminum engines would damage GMs reputation more than perhaps any other vehicle in its history. During the late 1970s, GM would initiate a wave of downsizing starting with the Chevrolet Caprice which was reborn into what was the size of the Chevrolet Chevelle, the Malibu would be the size of the Nova, and the Nova was replaced by the troubled front-wheel drive Chevrolet Citation.

[edit] Rebadging era

By the 1980s, GM frequently "rebadged" one division's successful vehicle into several models across the divisions, all positioned close to one another in the market place. Thus a new GM model's main competition might be another model spawned off the same platform. This led to market "cannibalization" with the divisions spending time stealing sales from one another. Even today, the company's GMT360 mid-sized light truck platform has spawned the basic Chevrolet TrailBlazer, Oldsmobile Bravada, GMC Envoy, Isuzu Ascender, Buick Rainier, and Saab 9-7X. Though each model had a more or less distinct mission, the trucks can hardly be discerned from one another.

[edit] GM in the new century

In the late 1990s, the U.S. economy was on the rise and GM and Ford gained market share producing enormous profits primarily from the sale of light trucks and sport-utility vehicles. From 2000 to 2001, the Federal Reserve in a move to quell the stock market, made twelve successive interest rate increases. Following the September 11, 2001 attacks, a severe stock market decline caused a pension and benefit fund underfunding crisis. GM began its Keep America Rolling campaign, which boosted sales, and other auto makers were forced to follow suit. The U.S. automakers saw sales increase to leverage costs as gross margins deteriorated. Although retiree health care costs remain a significant issue, General Motors' investment strategy has generated a $17.1 billion surplus in 2007 in its $101 billion U.S. pension fund portfolio, a $35 billion reversal from its $17.8 billion of underfunding.[13]

In 2004, GM redirected resources from the development of new sedans to an accelerated refurbishment of their light trucks and SUVs for introduction as 2007 models in early 2006. Shortly after this decision, fuel prices increased by over 50% and this in turn affected both the trade-in value of used vehicles and the perceived desirability of new offerings in these market segments. The current marketing plan is to extensively tout these revised vehicles as offering the best fuel economy in their class (of vehicle). GM claims its hybrid trucks will have gas-mileage improvements of 25%.

In the summer of 2005, GM announced that its corporate chrome emblem "Mark of Excellence" will begin appearing on all recently introduced and all-new 2006 model vehicles produced and sold in North America. The move is seen as an attempt by GM to link its name and vehicle brands more closely.

In 2005, GM promoted sales through an employee discount to all buyers. Marketed as the lowest possible price, GM cleared an inventory buildup of 2005 models to make way for its 2006 lineup. While the promotion was a temporary shot in the arm for sales, it did not help the company's bottom line. GM has since changed its marketing strategy to a no haggle sticker policy in which all vehicle prices are lowered, but incentives are reduced, if not eliminated.

[edit] GM in China

General Motors is the best selling auto maker in China.[14] The Buick brand is especially strong, led by the Buick Excelle subcompact. Cadillac initiated sales in China in 2004, starting with imports from the United States. GM pushed the marketing of the Chevrolet brand in China in 2005 as well, moving the former Buick Sail to that marque. The company manufactures most of its China-market vehicles locally, through its Shanghai GM joint venture. Shanghai GM, a joint venture between the Chinese company SAIC and General Motors, was created on March 25, 1997. The Shanghai GM plant was opened December 15, 1998 when the first Chinese-built Buick came off the assembly line. The SAIC-GM-Wuling Automobile joint-venture is also successful selling trucks and vans under the Wuling marque (34% belongs to GM).

GM plans to create a research facility in Shanghai for $250m to develop hybrid cars and alternative energy vehicles.[15]

[edit] Environmental Record

In the summer of 1999, the Environmental Protection Agency(EPA) removed 23,000 cubic yards of contaminated sediments and soil from the General Motors Superfund site in Massena, New York for disposal at a licensed facility in Utah. The amount contained 13,000 cubic yards of contaminated sediments dredged from the St.Lawrence River. The sediments had been stored on the site since 1995. There was also 10,000 cubic yards of contaminated sludge from the active wastewater treatment plant on the General Motors property.[16] General Motors was ranked 20th in the 2002 toxic 100. The company released 12,771,830 pounds of gases in the year 2002.[17] In September of 2006, the state of California filed suit against General Motors, Chrysler, Nissan, Toyota, Honda, and Ford. The companies were accused of producing cars that emitted over 289 million metric tons of carbon per year in the United States, accounting for nearly 20% of carbon emissions in the United States and 30% of carbon emissions in California.[18]

[edit] Subsidies

In March 2005, the Government of Canada provided C$200 million in incentives to General Motors for its Ontario plants to expand production and provide jobs, according to Jim Harris. Similar incentives were promised to non-North American auto companies like Toyota, Premier Dalton McGuinty said the money the province and Ottawa are pledging for the project is well-spent.

[edit] Labor relations

On September 24, 2007 General Motors workers represented by the United Auto Workers union went on the first nationwide strike against GM since 1970. The ripple effect of the strike reached into Canada the following day as two car assembly plants and a transmission facility were forced to close. However, overnight a tentative agreement was reached and UAW officials declared the end of the strike in a news conference at 4 a.m. on September 26. By the following day, all GM workers in both countries were back to work.

[edit] Outcome of strike

A new labor contract was ratified by UAW members exactly one week after the tentative agreement was reached, passing by a majority 62% vote. In the contract are several product and employment guarantees stretching well into the next decade. One of GM's key future products, the Chevy Volt, was promised to the GM Poletown/Detroit-Hamtramck plant in 2010. Also included is a VEBA (Voluntary Employee Beneficiary Association) which will transfer retiree health care obligations to the UAW by 2010. This eliminates more than 50 billion dollars from GM's healthcare tab. It will be funded by 30 billion in cash and 1.4 billion in GM stock paid to the UAW over the next 4 years of the contract. It also eliminates 70% of the labor cost gap with GM's Japanese rivals.

[edit] Auto racing

General Motors has an extensive history in numerous forms of racing. Vehicles of most, if not all, of GM's brands have been represented in competition, with perhaps Chevrolet being the most prominent. In particular, the Chevrolet Corvette has long been popular and successful in international road racing. GM also is a supplier of racing components, such as engines, transmissions, and electronics.

GM's Oldsmobile Aurora engine platform was successful in the Indy Racing League (IRL) throughout the 1990s, winning many races in the small V-8 class. An unmodified Aurora V-8 in the Aerotech, captured 47 world records, including the record for speed endurance in the Motorsports Hall of Fame of America. Recently, the Cadillac V-Series has entered motorsports racing. GM has also used many cars in the American racing series NASCAR. Currently the Chevrolet Impala is the only entry in the series but in the past the Pontiac Grand Prix, Buick Regal, Oldsmobile Cutlass, Chevrolet Lumina, Chevrolet Malibu, and the Chevrolet Monte Carlo were also used.

In touring cars (mainly in Europe) Vauxhall is a key player and former champion in the British Touring Car Championship (BTCC) series and competes with a Vauxhall Vectra in Super 2000 spec. Opel used to participate in the DTM series. Chevrolet competes with a Lacetti in the FIA World Touring Car Championship (WTCC).

In Australia, there is the prestigious V8 Supercar Championship which is battled out by the two main rivals of Holden& Ford. The current Holden Racing Team cars are based on the Holden Commodore and run a 5.0-litre V8-cylinder engine producing 650+BHP (approx 480 kW Power) @ 7500 rpm). These cars have a top speed of 300+km/h (185 mph) and run 0-100 km/h in less than 4 seconds. The Holden Racing Team is Australia's most successful team in Australian Touring Car History. In 2007 the Drivers championship was won by the very closely linked HSV Dealer Team

[edit] Development of Electronics for GM Auto Racing

In 1986, the GM Motorsports group asked Delco Electronics Corporation, a subsidiary of GM Hughes Electronics (headquarters - Kokomo, IN) if an electronic engine management system could be developed for the Chevy Indy V8 engines used in the CART open wheel racers. Delco Electronics had been supplying all GM automobiles sold in the USA with Engine Control Modules (ECMs) since 1981 when the USA Clean Air Act required 3-way catalytic converters and controlled air-fuel ratios. The production ECMs were becoming more complex, and were becoming powertrain controllers controlling the transmission, spark timing, Idle speed, as well as air-fuel intake mixtures.

Delco Electronics used a small group of electronic designers and technicians at their facility in Goleta, CA (near Santa Barbara, CA) to do special assignable projects that were advanced or more state of the art. This facility was called Delco Systems Operations (formerly known as GM Defense Research Labs), a part of Delco Electronics Corporation at the time. Delco Systems Operations is the place where the Apollo Program's Lunar Rover Mobility Sub-system[19] was developed and built, also the Apollo Program's guidance computers (Apollo PGNCS) and the Boeing 747 guidance computers (Delco Carousel IV) were developed and manufactured there. All Delco Electronics Motorsports products developed before 1994 were designed by this group. From 1994 to present, this activity is at Delco Electronics/Delphi in Kokomo, IN.

The first generation of engine management controller for CART racing used a modified production ECM, but performed poorly in the race car due to the harsh EMI (Electromagnetic Interference) environment. This version was never used in racing, but the experience gained enabled the engineers to design a more successful Generation 2 controller for use in the 1988 CART IndyCar World series.

Practice at Phoenix 1988. Mario Illien introduces the Gen II to Mario Andretti

Practice at Phoenix 1988. Mario Illien introduces the Gen II to Mario Andretti

Generation 2 controllers were used experimentally by Newman/Haas Racing in 1988 and the first win was in the Cleveland GP with Mario Andretti driving.

In 1989 Newman/Haas Racing, Team Penske, and Patrick Racing teams used Delco Electronics Gen-2 controllers with the Ilmor Chevy Indy V8 engine. "By the start of the 1989 season, racing pundits recognized that Chevrolet, with its Ilmor Engineering engines and Delco Electronics equipment, had assembled perhaps the most potent racing power in the history of the sport. As the season got under way in April, the pattern of winning began. Racing's elite drivers -- Unser junior and senior, Fittipaldi, Rick Mears, and Mario Andretti -- were driving the best equipment in the world.

The results began to show early on. By October, Chevy engines with DE equipment had won 13 of the 15 IndyCar races.

DSO Motorsports Management Group & Friends Watching the 1989 Indy 500 at Butler's Pizza in Goleta, CA

DSO Motorsports Management Group & Friends Watching the 1989 Indy 500 at Butler's Pizza in Goleta, CA

When Emerson Fittipaldi crossed the finish line to win the 1989 Indianapolis 500, racing fans witnessed history being made. Fans thrilled to the neck-and-neck finish between Fittipaldi and Al Unser Jr. who went spinning on lap 198 after brushing tires with Emmo, and the 43-year-old Barazilian had his first Indianapolis 500 win. Fittipaldi's victory -- in a Chevrolet Indy V8 engine controlled by a Delco Electronics electronic engine control module (ECM) -- was the first time in the 500's storied history that the engine of the winning vehicle was controlled by an electronic engine management system"[20]

Gen-2 Conroller that was in the 1989 Indy 500 Winning Car

Gen-2 Conroller that was in the 1989 Indy 500 Winning Car

For the 1990 season, all teams using the Ilmor Chey Indy V8 were provided a redesigned Gen-3 system and it won 15 poles, 16 wins including the 1990 Indianapolis 500, with 17 races in the IndyCar World Series. To prove the system, the components were used with GM engines in the Trans-Am Racing series during 1989.

In the 1991 IndyCar World Series, Gen-3 had a perfect score: 17 poles, 17 wins, 17 races including the 1991 Indianapolis 500. At the 1991 Indianapolis 500, Delco Electronics introduced telemetry to the electronic system using the advanced spread spectrum radio technology[21] . It was so popular that all IndyCar teams eventually used it, and many still use it. ABC TV used the data from the systems to display real time data with ABC's in-car video cameras.

In 1990 and 1991, the Chevy engine with the Delco Electronics Gen-3 controller won 33 straight IndyCar races. Chevy's dominance proved electronics had found their place in IndyCar racing.

In the 1992 IndyCar World Series, race cars with Gen-3 captured 7 poles, 11 wins including the 1992 Indianapolis 500, in 16 races.

For the 1993 IndyCar World Series, Delco Electronics had been developing a smaller more powerful controller using 32-bit computers and a high-level software language called Modula-GM. This system was called Gen-4 and won much praise for its improved functions and features. The telemetry system developed for the 1992 season was used, and a new Distributorless Ignition module component was added to the overall engine management system. 10 wins including the 1993 Indianapolis 500 in 16 CART races.

Left to Right Gen-4, Gen-3, Gen-2, & Gen-1 Delco Electronics Motorsport Engine Control Modules

Left to Right Gen-4, Gen-3, Gen-2, & Gen-1 Delco Electronics Motorsport Engine Control Modules

In 1994, a totally new Ilmor engine was introduced to IndyCar teams and the engine controller was Delco Electronics Gen-4: 12 wins including the 1994 Indianapolis 500, 16 races.

In 1995, Gen-4 won 6 races out of 17.

In 1996, the Indy Racing League split from CART and used the naturally aspirated Oldsmobile Aurora engine which used the Delco Electronics Gen-4 system until the engine was retired from the IRL IndyCar Series a few years ago. 1997 was the last year the Gen-4 ran in the CART IndyCar World Series.

Per a February 27, 2003 Delphi Press Release[22], Delphi's current involvement in open wheel racing is as follows:

"Delphi is the official electronics provider to the IRL and has been involved in open-wheel racing since 1988. Today, a majority of the vehicles in the IRL are equipped with several of Delphi's racing products including:

  • Delphi Earpiece Sensor System - measures dynamic forces to a driver's head during an accident. It uses small sensors integrated into the left and right radio earpieces worn by the driver. The six accelerometers -- one for each of the three axes on each side -- measure acceleration in the X, Y and Z axes during an accident. The combined data from the earpiece sensor system and onboard accident data recorder provide accident researchers valuable data for a clearer picture of what happens during a crash.
  • Accident Data Recorder (ADR2) - senses and records key vehicle parameters at 1,000 samples per second just prior to, during, and after an accident-triggering event.
  • Track Condition Radio - helps alert drivers with critical information by transmitting messages from race control to the racecar. A dash-mounted display communicates messages including safety warnings, track condition and pits opened/closed.
  • Radio Telemetry Module - transmits engine and chassis data from a speeding racecar to race team engineers located in the pits. The telemetry module helps enhance driver safety and race team strategy by making real-time data available.
  • Multec(R) Bottom Feed Methanol Electronic Fuel Injector - provides a high flow rate and a low profile package that are ideal for port fuel racing applications. The injector is able to operate at high temperatures and provide a high level of spray atomization.
  • Connectors, Cables and Terminals - connecto

beeway 發表在 痞客邦 留言(0) 人氣()


Bewise Inc. www.tool-tool.com Reference source from the internet.

摘要:对国际先进制造技术研讨会(ISAMT’2001)暨中国高校切削与先进制造技术研究会第七届年会的有关论文进行了综合评述,分析了国内切削加工和刀具技术的现状,并对今后的发展策略提出了建议。

1 引言
国 际先进制造技术研讨会(ISAMT’2001)暨中国高校切削与先进制造技术研究会第七届年会于2001年10月在南京举行。大会共征集到论文200多 篇,其中关于切削技术方面的论文33篇,刀具与刀具材料方面的论文32篇,论文内容涉及制造领域中现代切削技术的新发展、刀具新材料和新结构、切削机理实 验研究以及计算机技术在切削与刀具领域的开发与应用等。现对会议宣读和交流论文中的相关内容作一综合评述。
2 现代切削技术的发展
20世纪90年代以来,激烈的市场竞争推动以机械制造技术为先导的先进制造技术以前所未有的速度和广度向前发展。高生产率和高质量是先进制造技术追求的两大目标。高速切削、精密和超精密切削是当前切削技术的重要发展方向,已成为切削加工的主流技术。
高速切削技术
高速切削的主要内容包括高速软切削、高速硬切削、高速干切削、大进给切削等。高速切削是一个相对概念,对其切削速度范围的界定目前国内外专家尚未达成共识。通常认为高速加工时的切削速度比常规切削速度高5~10倍以上。
中 国工程院院士艾兴教授在所作“高速切削刀具材料的发展及其合理应用”主题报告中指出,在高速切削时,随着切削速度的提高,切削力减小,切削温度的增加渐 趋缓慢,生产效率和加工质量提高,从而可降低制造成本,缩短产品开发周期。高速切削大致可使切削力减小15%~30%,表面质量提高1~2级,切削速度和 进给速度提高15%~20%,制造成本降低10%~15%。高速切削现已广泛应用于航空、航天、汽车、摩托车、模具、机床等工业中对钢、铸铁、有色金属及 其合金、高温耐热合金、碳纤维增强塑料等复合材料的加工中,其中以铝合金和铸铁的高速加工最为普遍。目前高速加工各种材料的切削速度:普通钢和铸铁为 500~2000m/min(钻、铰削100~400m/min,攻丝100m/min,滚齿300~600m/min),淬硬钢(35~65HRC)为 100~400m/min,结构铝合金为3000~4000m/min,高硅铝合金为500~1500m/min,镍基、钴基、铁基和钛合金等超级合金为 90~500m/min。高速加工追求的切削速度目标为:铣削加工:铝及其合金为10000m/min,铸铁为5000m/min,普通钢为 2500m/min;钻削加工(机床主轴转速):铝及其合金为30000r/min,铸铁为20000r/min,普通钢为10000r/min。大进给 目标:进给速度Vf=20~50m/min,每齿进给量fz=1.0~1.5mm/z。
高速切削技术不只是切削速度的提高,它的发展主要取决于刀 具技术(包括刀具材料、涂层刀具结构、刀柄和装夹系统、刃磨和动平衡、检测和监控系统等)和高速 机床技术(包括电主轴、直线电机进给系统、数控与伺服系统、轴承及润滑、刀库等)的进步,而正确选用刀具与机床经常起着决定性作用。德国 Darmstadt工业大学H.Schulz教授在“高速切削机床”一文中详尽介绍了选用高速机床时应注意的问题,给与会代表很大启发。
随着环境 保护法律法规的严格实施,作为绿色制造工艺的干切削日益受到人们的高度重视。据国外企业统计,在集中冷却加工系统中,切削液占加工总成本的14% ~16%,刀具成本仅占2%~4%。据测算,如果20%的切削加工采用干式加工,制造总成本可降低1.6%。因此,干切削是未来切削加工的发展方向。目前 倡导的干切削并不是简单地去掉原有工艺中的切削液,也不是消极地通过降低切削参数来保证刀具使用寿命,而需要采用耐热性更好的新型刀具材料及涂层,设计合 理的刀具结构与几何参数,选择最佳切削速度,形成新的工艺条件。干切削是实现清洁高效加工的新工艺,是制造技术向高速切削发展总趋势的组成部分,也是随着 人类社会进步和生产力发展而出现的新型切削方式,它的推广应用推动着刀具材料、涂层技术、机床结构、加工条件和刀具结构技术的不断发展。目前,干切削技术 在车削、镗削和铣削上的应用日益广泛,在钻削、拉削和滚齿方面也有重大突破。上海大众汽车有限公司、上海交通大学、哈尔滨理工大学、哈尔滨工业大学等单位 在“干切削及其应用”等有关论文中详细介绍了干切削的机理和实施该工艺的途径,以及采用激光辅助加工干切削、使用最少量润滑液(MQL)的准干切削 (Near Dry Cutting)、用压缩空气冷风切削以及采用氮气进行干切削等加工方法。
精密和超精密切削
发展尖端技术、国防工业 和微电子工业都离不开通过精密和超精密加工制造的精密零件和产品。通常将加工精度在0.1~1µm,加工表面粗糙度在 Ra0.02~0.1µm的加工称为精密加工;而将加工精度高于0.1µm,加工表面粗糙度小于Ra0.01µm的加工称为超精密加工。超精密加工可达到 纳米(nm)级水平。该领域主要包含三个分支:①精密和超精密切削加工;②精密和超精密磨削加工;③精密电子束和离子束等特种加工。
用金刚石刀具 实施超精密切削已由过去只能加工铜、铝及其合金等有色金属,扩展到加工塑料、陶瓷和复合材料。为了切除极薄切屑,要求金刚石刀具切削刃的刃口 半径p极小,经精密研磨的单晶天然金刚石刀具的刃口半径p<0.05~0.1µm,研磨质量高的甚至可达几个nm,可实现纳米级切削。> 45HRC)和冷硬铸铁等硬材料、以车代磨等加工领域跨入到铣削加工领域。该刀具已在上海通用汽车公司(SGM)新建的 发动机柔性生产线上使用,取得了良好效果。该刀具铣削发动机缸体平面时,切削速度高达2000m/min,刀具寿命为普通PCBN刀具的4倍。Seco Tools公司还推出了结构新颖、具有冷却通道、可更换硬质合金头部的钻头,其头部有三种不同几何形状,P型硬质合金刀头适用于切削钢,K型硬质合金刀头 适于切削铸铁,而刀刃锐利的M型刀头适于钻削高强度钢和耐腐蚀钢。
本次会议对传统刀具和高效刀具的设计、制造及使用也进行了技术交流。如广东韶关 学院设计的径向错位量较大(为每转进给量的2~3倍)的单组阶梯式可转位面 铣刀、燕山大学研制的可加工硬度55HRC以上大内齿轮(模数m=12mm,齿数z=97)的负前角刮削硬质合金球形滚刀、西安交通大学设计的前角可控的 等螺旋角锥形立铣刀、山西太原理工大学设计的齿向开槽的新型插齿刀等,在结构上都有一定特点与创新,用于生产中均取得了较好效果。
电镀金刚石铰刀加工出的孔具有尺寸分散度小、几何形状精度高(可达2µm)、表面粗糙度值小(5 切削机理的研究与刀具CAD
为促进高速切削、精密和超精密切削技术的发展,本次会议上交流了许多有关切削机理及其实验研究方面的论文。
南 京航空航天大学对高温合金、钛合金、不锈钢等难加工材料的高速切削进行了系统试验研究,发现切削变形为集中剪切滑移,且滑移区很窄,形成锯齿状不连续切 屑,其变形机理完全不同于连续性切屑。为此,作者根据最小能量原理,利用集中剪切滑移的临界条件,推导出集中剪切滑移条件下的切削方程式,为进一步发展高 速切削工艺技术建立了理论基础。
山东大学探讨了高速切削时工件材料与刀具材料的匹配、切削方式、刀具几何参数、切削参数、振动和切削液等因素对已加工表面粗糙度的影响,为高速切削加工时切削参数的选择和表面质量的控制提供了依据。
哈 尔滨理工大学、哈尔滨工业大学等对PCBN刀具干切削不同硬度的GCr15轴承钢的切削力、切削温度、已加工表面完整性等进行了切削试验研究,发现存在 区分普通切削与硬态切削的临界硬度,并得出GCr15轴承钢的临界硬度为50HRC。在临界硬度附近进行切削时,刀具磨损严重,加工表面质量最差。
上海水产大学建立了“工程材料切削加工性的人工神经网络综合评判模型”,各评价指标的权值是从足够多的训练样本中提出的,避免了人为确定权值和隶属函数的主观性,使评价结果更具客观性和可比性。
大连理工大学建立了球头铣刀铣削的计算机预报模型,并进行了数值仿真研究,对改进铣刀设计、优化切削用量和监控切削参数均有现实意义。
Jr.S.Prakash等学者在会上介绍的“微型硬质合金铣刀切削时刀具寿命的预报模型”,J.Wang等人介绍的“斜角切削时允许后刀面磨损的切削预报模型”等均与实验结果相吻合,为精密切削和微量切削提供了理论依据。
CAD/CAM技术的应用可保证刀具设计和制造的高效率和高质量,本次会议上也有不少这方面的论文。例如,焦作工学院在AutoCAD2000平台上开发了一种“成形车刀CAD”软件,对成形车刀的智能设计、参数化绘图具有重要意义。
此外,还有许多关于刀具几何参数、切削用量和工艺过程优化、切削液、切削数据库(如北京第一机床厂在CIMS环境下建立的网络数据库)、振动切削等内容的论文也在会上进行了交流。
6 差距与建议
虽 然近十年来我国工具工业有了长足进步,切削技术迅速提高,但与国外先进水平相比仍有巨大差距。据专家分析,我国切削加工及刀具技术的水平与工业发达国家 相比大致要落后15~20年。近年来国内轿车工业引进了几条具有国际20世纪90年代水平的生产线,但所用工具的国内供给率只能达到20%的低水平。为改 变这种状况,我国工具行业需要加速进口刀具国产化的步伐,必须更新经营理念,从主要向用户“卖刀具”转到为用户“提供成套切削技术,解决具体加工问题”的 经营方向上来。要根据自身产品的专业优势,精通相应的切削工艺,不断创新开发新产品。用户行业则应增大刀具费用的投入,充分利用刀具在提高效率、降低成 本、缩短Intranet/Extranet,实现最大程度的资源(如切削数据库)共享。建议有关部门将产、学、研各部门的科研力量组织起来,集中优势, 一方面积极引进国外先进刀具制造技术,提高刀具产品水平,加快刀具产品(尤其是数控刀具产品)的国产化步伐;另一方面应结合生产实际,系统地推广使用各种 先进刀具和先进切削技术。我们相信,通过正确的政策引导和企业的有序竞争,完全有可能使我国的切削加工与刀具技术赶上国外先进水平,并做到有所发展与创 新。

歡迎來到Bewise Inc.的世界,首先恭喜您來到這接受新的資訊讓產業更有競爭力,我們是提供專業刀具製造商,應對客戶高品質的刀具需求,我們可以協助客戶滿足您對產業的不同要求,我們有能力達到非常卓越的客戶需求品質,這是現有相關技術無法比擬的,我們成功的滿足了各行各業的要求,包括:精密HSS DIN切削刀具協助客戶設計刀具流程DIN or JIS 鎢鋼切削刀具設計NAS986 NAS965 NAS897 NAS937orNAS907 航太切削刀具,NAS航太刀具設計超高硬度的切削刀具BW捨棄式鑽石V卡刀BW捨棄式金屬圓鋸片木工捨棄式金屬圓鋸片PCD木工圓鋸片醫療配件刀具設計汽車業刀具設計電子產業鑽石刀具全鎢鋼V卡刀-電路版專用全鎢鋼鋸片焊刃式側銑刀焊刃式千鳥側銑刀焊刃式T型銑刀焊刃式千鳥T型銑刀焊刃式螺旋機械鉸刀全鎢鋼斜邊刀電路版專用鎢鋼焊刃式高速鉸刀超微粒鎢鋼機械鉸刀超微粒鎢鋼定點鑽焊刃式帶柄角度銑刀焊刃式螺旋立銑刀焊刃式帶柄倒角銑刀焊刃式角度銑刀焊刃式筒型平面銑刀木工產業鑽石刀具等等。我們的產品涵蓋了從民生刀具到工業級的刀具設計;從微細刀具到大型刀具;從小型生產到大型量產;全自動整合;我們的技術可提供您連續生產的效能,我們整體的服務及卓越的技術,恭迎您親自體驗!!

BW Bewise Inc. Willy Chen willy@tool-tool.com bw@tool-tool.com www.tool-tool.com skype:willy_chen_bw mobile:0937-618-190 Head &Administration Office No.13,Shiang Shang 2nd St., West Chiu Taichung,Taiwan 40356 http://www.tool-tool..com / FAX:+886 4 2471 4839 N.Branch 5F,No.460,Fu Shin North Rd.,Taipei,Taiwan S.Branch No.24,Sec.1,Chia Pu East Rd.,Taipao City,Chiayi Hsien,Taiwan

Welcome to BW tool world! We are an experienced tool maker specialized in cutting tools. We focus on what you need and endeavor to research the best cutter to satisfy users demand. Our customers involve wide range of industries, like mold & die, aerospace, electronic, machinery, etc. We are professional expert in cutting field. We would like to solve every problem from you. Please feel free to contact us, its our pleasure to serve for you. BW product including: cutting toolaerospace tool .HSS DIN Cutting toolCarbide end millsCarbide cutting toolNAS Cutting toolNAS986 NAS965 NAS897 NAS937orNAS907 Cutting Tools,Carbide end milldisc milling cutter,Aerospace cutting toolhss drillФрезерыCarbide drillHigh speed steelMilling cutterCVDD(Chemical Vapor Deposition Diamond )’PCBN (Polycrystalline Cubic Boron Nitride) Core drillTapered end millsCVD Diamond Tools Inserts’PCD Edge-Beveling Cutter(Golden FingerEdge modifying knifeSolid carbide saw blade-V typeV-type locking-special use for PC boardMetal Slitting SawaCarbide Side milling CuttersCarbide Side Milling Cutters With Staggered TeethCarbide T-Slot Milling CuttersCarbide T-Slot Milling Cutters With Staggered TeethCarbide Machine ReamersHigh speed reamer-standard typeHigh speed reamer-long type’’PCD V-CutterPCD Wood toolsPCD Cutting toolsPCD Circular Saw BladePVDD End Millsdiamond tool V-type locking-special use for PC board Single Crystal Diamond Metric end millsMiniature end millsСпециальные режущие инструменты Пустотелое сверло Pilot reamerFraisesFresas con mango PCD (Polycrystalline diamond) ‘FreseElectronics cutterStep drillMetal cutting sawDouble margin drillGun barrelAngle milling cutterCarbide burrsCarbide tipped cutterChamfering toolIC card engraving cutterSide cutterNAS toolDIN or JIS toolSpecial toolMetal slitting sawsShell end millsSide and face milling cuttersSide chip clearance sawsLong end millsStub roughing end millsDovetail milling cuttersCarbide slot drillsCarbide torus cuttersAngel carbide end millsCarbide torus cuttersCarbide ball-nosed slot drillsMould cutterTool manufacturer.

Bewise Inc. www.tool-tool.com

ようこそBewise Inc.の世界へお越し下さいませ、先ず御目出度たいのは新たな

情報を受け取って頂き、もっと各産業に競争力プラス展開。

弊社は専門なエンドミルの製造メーカーで、客先に色んな分野のニーズ

豊富なパリエーションを満足させ、特にハイテク品質要求にサポート致します。

弊社は各領域に供給できる内容は:

(1)精密HSSエンドミルのR&D

(2)Carbide Cutting tools設計

(3)鎢鋼エンドミル設計

(4)航空エンドミル設計

(5)超高硬度エンドミル

(6)ダイヤモンドエンドミル

(7)医療用品エンドミル設計

(8)自動車部品&材料加工向けエンドミル設計

弊社の製品の供給調達機能は:

(1)

beeway 發表在 痞客邦 留言(0) 人氣()


根據華爾街日報 (WSJ) 報導,
美國專利商標局正式通過蘋果在一月份以 iPod 外觀設計
(右圖有按鍵轉盤那種...) 所申請的商標.
這件事情可不得了,
因為一般若是以專利的名義申請,
所能得到的專利擁有權是有一定年限的,
而若是以商標來申請, 那可就沒有這些限制,

其實這也不是第一次有過的非傳統商標,
包括像是可口可樂也是幾乎把所有瓶子的設計,
都給他拿去申請商標,
而且基本上好像也沒啥異議的樣子,

重點來了,最大的影響是什麼呢?
市面上外觀和ipod相同的盜版品都不能出啦!
所以,
假ipod哭吧!
「曾經」的盜版王國雖然盜版還是蠻嚴重的,
但現在已經落到第三名囉!
根據調查日本和新加坡盜版率都高於台灣呀~
版大個人覺得是值得高興的啦!
尊重智慧財產權還是很重要的,
但很多電腦軟體那麼貴,
雖然製作很難,
但是版大這種平民實在是買不起呀>v<~(咦!?這代表版大@%$%@$@#?) 各位覺得呢? [資料來源]
Read - 華爾街日報報導 (詳盡到炸, 有興趣的朋友必讀 ^^)
Read - Apple iPod 外觀設計 "商標" 申請案 (這不是白話文, 這不是白話文...翻滾)

歡迎進入Beeway的憶想世界以記憶體為基調 結合創新科技、設計美學、健康概念、工業藝術、與時尚流行等元素

beeway 發表在 痞客邦 留言(0) 人氣()


各位看倌,
看到這張圖片你的第一個想法是啥呢?
我第一個感覺是,
挖…日本的上班族果然有忙呀!
第二個感覺則是,
酸喲~
快點落跑~
這是日本出品的四埠USB Hub,
型號為DN-USB EXIT HUB,
日幣價格是說「千元有找」啦!
台幣的話則是約三百扣扣,
其實我覺得還蠻吸引我的說!
只是最近的USB產品愈來愈多,
但需求電量愈來愈高,
像版的的隨身碟碟用到後來得用兩條USB線從電腦拉電才開的動一一"
不然就讀不到,真是令人無言…
而且在XP中如果在這四個HUB插上四個隨身碟,
它都能讀得到嗎?
這也蠻令我懷疑的一一"(汗)


另一面的圖

公事包HUB

腳HUB

另一面的圖

[資料來源]


歡迎進入Beeway的憶想世界以記憶體為基調 結合創新科技、設計美學、健康概念、工業藝術、與時尚流行等元素, 賦予隨身碟更豐富多元的面貌.

Beeway專門設計製造USB隨身碟飾品,最新產品為高品質的鈦鍺USB隨身碟項鍊組

Mail:nochingyo@beeway.com.tw 網址www.beeway.com.tw

TEL:886 4 24759277 FAX:886 4 24714839

We manufacture and design USB Flash Drive Disk / Memory Stick with accessory by combining advanced tech, stylish esthetics, health concept, craft, and fashion. Creativity is our best power.

beeway 發表在 痞客邦 留言(0) 人氣()


網路上有位大哥改編某知名手機廣告,
作為求婚的大絕招~
基本上廣告的前大部份都和真正的廣告差不多,
都是展現手機的特色,
並配上「this is your music, this is your photos」的旁白,
重點在結尾的地方,
多了句「this is a proposal」,
裡面的影片看得版大我都會心一笑:)
都想跟那女孩說~嫁給他吧!
下面大家就一起來欣賞一下吧^^~

[資料來源]

歡迎進入Beeway的憶想世界以記憶體為基調 結合創新科技、設計美學、健康概念、工業藝術、與時尚流行等元素, 賦予隨身碟更豐富多元的面貌.

Beeway專門設計製造USB隨身碟飾品,最新產品為高品質的鈦鍺USB隨身碟項鍊組

Mail:nochingyo@beeway.com.tw 網址www.beeway.com.tw

TEL:886 4 24759277 FAX:886 4 24714839

We manufacture and design USB Flash Drive Disk / Memory Stick with accessory by combining advanced tech, stylish esthetics, health concept, craft, and fashion. Creativity is our best power.

beeway 發表在 痞客邦 留言(0) 人氣()