BW Professional Cutter Expert www.tool-tool.com

Bewise Inc. www.tool-tool.com Reference source from the internet.

Metalorganic vapour phase epitaxy (MOVPE) is a chemical vapour deposition method of epitaxial growth of materials, especially compound semiconductors from the surface reaction of organic compounds or metalorganics and metal hydrides containing the required chemical elements. For example, indium phosphide could be grown in a reactor on a substrate by introducing Trimethylindium ((CH₃)₃In) and phosphine (PH₃). Alternative names for this process include organometallic vapour phase epitaxy (OMVPE), metalorganic chemical vapour deposition (MOCVD) and organometallic chemical vapour deposition (OMCVD). Formation of the epitaxial layer occurs by final pyrolisis of the constituent chemicals at the substrate surface. In contrast to molecular beam epitaxy (MBE) the growth of crystals is by chemical reaction and not physical deposition. This takes place not in a vacuum, but from the gas phase at moderate pressures (2 to 100 kPa). As such this technique is preferred for the formation of devices incorporating thermodynamically metastable alloys. It has become the dominant process for the manufacture of laser diodes, solar cells, and LEDs.

[edit] Reactor components

• A reactor is a chamber made of a material that does not react with the chemicals being used. It must also withstand high temperatures. This chamber is composed by reactor walls, liner, a susceptor, gas injection units, and temperature control units. Usually, the reactor walls are made from stainless steel or quartz. To prevent over heating, cooling water must be flowing through the channels within the reactor walls. Special glasses, such as quartz or ceramic, are often used as the liner in the reactor chamber between the reactor wall and the susceptor. A substrate sits on a susceptor which is at a controlled temperature. The susceptor is made from a material resistant to the metalorganic compounds used; graphite is sometimes used. For growing nitrides and related materials, a special coating on the graphite susceptor is necessary to prevent corrosion by ammonia (NH₃) gas.

• Gas inlet and switching system. Gas is introduced via devices known as 'bubblers'. In a bubbler a carrier gas (usually nitrogen or hydrogen) is bubbled through the metalorganic liquid, which picks up some metalorganic vapour and transports it to the reactor. The amount of metalorganic vapour transported depends on the rate of carrier gas flow and the bubbler temperature. Allowance must be made for saturated vapours.

• Pressure maintenance system

• Gas Exhaust and cleaning System. Toxic waste products must be converted to liquid or solid wastes for recycling (preferably) or disposal. Ideally processes will be designed to minimize the production of waste products.

[edit] Metalorganic gases

A non-exhaustive list of metalorganic chemicals used to grow semiconductors by MOVPE.

• Aluminium
  • Trimethylaluminium CAS 75-24-1
  • Triethylaluminium CAS 97-93-8

• Gallium
  • Trimethylgallium (TMG or TMGa)
  • Triethylgallium (TEG or TEGa)
  • Triisopropylgallium (TIPG or TIPGa) Ga(C₃H₇)₃

• Indium
  • Trimethylindium (TMI or TMIn)
  • Triethylindium (TEI or TEIn)
  • Di-isopropylmethylindium (DIPMeIn)

• Germanium
  • Isobutylgermane (IBGe)
  • Dimethylamino germanium trichloride (DMAGeC)

• Nitrogen
  • Phenyl hydrazine
  • Dimethylhydrazine
  • Ammonia

• Phosphorus
  • Phosphine
  • Tertiarybutyl phosphine (TBP)

• Arsenic
  • Arsine AsH₃
  • Phenylarsine
  • Tertiarybutyl arsine (TBAs)

• Antimony
  • Trimethyl antimony (TMSb)
  • Triethyl antimony (TESb)
  • Stibine SbH₃

• Cadmium
  • Dimethyl cadmium (DMCd)

• Tellurium
  • Dimethyl telluride (DMTe)
  • Diethyl telluride (DETe)
  • Diisopropyl telluride (DIPTe)

[edit] Semiconductors grown by MOVPE

[edit] III-V semiconductors

• AlGaAs
• AlGaInP
• AlGaN
• AlGaP
• GaAsP
• GaAs
• GaN
• GaP
• InAlAs
• InAlP
• InSb
• InGaAlAs
• InGaAlN
• InGaAsN
• InGaAsP
• InGaAs
• InGaN
• InGaP
• InN
• InP

[edit] II-VI semiconductors

• Zinc selenide (ZnSe)
• HgCdTe
• ZnO
• Zinc sulfide (ZnS)

[edit] IV Semiconductors

• Si
• Ge
• Strained silicon

歡迎來到Bewise Inc.的世界，首先恭喜您來到這接受新的資訊讓產業更有競爭力，我們是提供專業刀具製造商，應對客戶高品質的刀具需求，我們可以協助客戶滿足您對產業的不同要求，我們有能力達到非常卓越的客戶需求品質，這是現有相關技術無法比擬的，我們成功的滿足了各行各業的要求，包括：精密HSS DIN切削刀具、協助客戶設計刀具流程、DIN or JIS 鎢鋼切削刀具設計、NAS986 NAS965 NAS897 NAS937orNAS907 航太切削刀具,NAS航太刀具設計、超高硬度的切削刀具、醫療配件刀具設計、汽車業刀具設計、電子產業鑽石刀具、木工產業鑽石刀具等等。我們的產品涵蓋了從民生刀具到工業級的刀具設計；從微細刀具到大型刀具；從小型生產到大型量產；全自動整合；我們的技術可提供您連續生產的效能，我們整體的服務及卓越的技術，恭迎您親自體驗！！

BW Bewise Inc. Willy Chen willy@tool-tool.com bw@tool-tool.com www.tool-tool.com skype:willy_chen_bw mobile:0937-618-190 Head &Administration Office No.13,Shiang Shang 2nd St., West Chiu Taichung,Taiwan 40356 http://www.tool-tool..com / FAX:+886 4 2471 4839 N.Branch 5F,No.460,Fu Shin North Rd.,Taipei,Taiwan S.Branch No.24,Sec.1,Chia Pu East Rd.,Taipao City,Chiayi Hsien,Taiwan

Welcome to BW tool world! We are an experienced tool maker specialized in cutting tools. We focus on what you need and endeavor to research the best cutter to satisfy users’ demand. Our customers involve wide range of industries, like mold & die, aerospace, electronic, machinery, etc. We are professional expert in cutting field. We would like to solve every problem from you. Please feel free to contact us, its our pleasure to serve for you. BW product including: cutting tool、aerospace tool .HSS DIN Cutting tool、Carbide end mills、Carbide cutting tool、NAS Cutting tool、NAS986 NAS965 NAS897 NAS937orNAS907 Cutting Tools,Carbide end mill、disc milling cutter,Aerospace cutting tool、hss drill’Фрезеры’Carbide drill、High speed steel、Milling cutter、CVDD(Chemical Vapor Deposition Diamond )’PCBN (Polycrystalline Cubic Boron Nitride) ’Core drill、Tapered end mills、CVD Diamond Tools Inserts’PCD Edge-Beveling Cutter(Golden Finger’PCD V-Cutter’PCD Wood tools’PCD Cutting tools’PCD Circular Saw Blade’PVDD End Mills’diamond tool ‘Single Crystal Diamond ‘Metric end mills、Miniature end mills、Специальные режущие инструменты ‘Пустотелое сверло ‘Pilot reamer、Fraises’Fresas con mango’ PCD (Polycrystalline diamond) ‘Frese’Electronics cutter、Step drill、Metal cutting saw、Double margin drill、Gun barrel、Angle milling cutter、Carbide burrs、Carbide tipped cutter、Chamfering tool、IC card engraving cutter、Side cutter、NAS tool、DIN or JIS tool、Special tool、Metal slitting saws、Shell end mills、Side and face milling cutters、Side chip clearance saws、Long end mills、Stub roughing end mills、Dovetail milling cutters、Carbide slot drills、Carbide torus cutters、Angel carbide end mills、Carbide torus cutters、Carbide ball-nosed slot drills、Mould cutter、Tool manufacturer.

Bewise Inc. www.tool-tool.com

ようこそＢｅｗｉｓｅ　Ｉｎｃ.の世界へお越し下さいませ、先ず御目出度たいのは新たな

情報を受け取って頂き、もっと各産業に競争力プラス展開。

弊社は専門なエンド・ミルの製造メーカーで、客先に色んな分野のニーズ、

豊富なパリエーションを満足させ、特にハイテク品質要求にサポート致します。

弊社は各領域に供給できる内容は：

（１）精密ＨＳＳエンド・ミルのＲ＆Ｄ

（２）Carbide Cutting tools設計

（３）鎢鋼エンド・ミル設計

（４）航空エンド・ミル設計

（５）超高硬度エンド・ミル

（６）ダイヤモンド・エンド・ミル

（７）医療用品エンド・ミル設計

（８）自動車部品＆材料加工向けエンド・ミル設計

弊社の製品の供給調達機能は：

（１）生活産業～ハイテク工業までのエンド・ミル設計

（２）ミクロ・エンド・ミル～大型エンド・ミル供給

（３）小Ｌｏｔ生産～大量発注対応供給

（４）オートメーション整備調達

（５）スポット対応～流れ生産対応

弊社の全般供給体制及び技術自慢の総合専門製造メーカーに貴方のご体験を御待ちしております。

BW специализируется в научных исследованиях и разработках, и снабжаем самым высокотехнологичным карбидовым материалом для поставки режущих / фрезеровочных инструментов для почвы, воздушного пространства и электронной индустрии. В нашу основную продукцию входит твердый карбид / быстрорежущая сталь, а также двигатели, микроэлектрические дрели, IC картонорезальные машины, фрезы для гравирования, режущие пилы, фрезеры-расширители, фрезеры-расширители с резцом, дрели, резаки форм для шлицевого вала / звездочки роликовой цепи, и специальные нано инструменты. Пожалуйста, посетите сайт www.tool-tool.com для получения большей информации.