Bewise Inc.
轉述
離子束濺鍍沉積參數及調變範圍
圖示:
晶種層之沉積
金屬連線在深次微米製程中,via或trench的填充能力,是影響製程技術重要的關鍵,若是填充能力不良在via或trench中形成孔洞或是階梯覆蓋不均勻,會造成電阻率激增且性質不均。
通 常會影響via或trench填充能力的因素除了無電鍍銅的晶粒大小及其沉積速率之外,催化晶種層也扮演重要角色,催化層與擴散阻障層的附著力以及階梯覆 蓋率(step coverage),影響銅膜與擴散阻障層間的附著性。若是無電鍍銅晶粒過大將無法填入較小的via或trench,因此適當的晶粒大小有助於小洞的填 充。
而沉積速率太快則使得銅膜成長鬆散、不緻密,在較小的via或trench中容易形成void或不連續的膜,故控制適當的沉積速率才能獲得良好的鍍膜品質。
圖示:
(a)
圖示:
(b)
(a) 介電層經過圖案化再沉積阻障層之試片截面,將試片劈開後,利用FESEM觀察其橫截面,此via深1μm、寬0.5μm,深寬比約2:1。(b)相同的試 片經過離子束濺鍍沉積後,濺鍍沉積時間為30分鐘之試片截面,由圖上看到via最底層以及上層的壁上均附著較薄的銅晶種層。
圖示:
濺鍍沉積時間45分鐘之試片截面,一樣可看出有較薄的銅晶種層附著,此via深1μm、寬1μm,深寬比約1:1。
碧威股份有限公司www.tool-tool.com
國立勤益技術大學機械系
教授:張子欽博士
Welcome to BW tool world! We are an experienced tool maker specialized in cutting tools. We focus on what you need and endeavor to research the best cutter to satisfy users’ demand. Our customers involve wide range of industries, like mold & die, aerospace, electronic, machinery, ,,,etc. We are professional expert in cutting field. We would like to solve every problem from you. Please feel free to contact us, it’s our pleasure to serve for you. BW product including: utting tool、aerospace tool .HSS Cutting tool、Carbide end mills、Carbide cutting tool、NAS Cutting tool、Carbide end mill、Aerospace cutting tool、Carbide drill、High speed steel、Milling cutter、Core drill、Taperd end mills、Metric end mills、Miniature end mills、Pilot reamer、Electronics cutter、Step drill、Metal cutting saw、Double margin drill、Gun barrel、Angle milling cutter、Carbide burrs、Carbide tipped cutter、Chamfering tool、IC card engraving cutter、Side cutter、NAS tool、DIN tool、Special tool、Metal slitting saws、Shell end mills、Side and face milling cutters、Side chip clearance saws、Long end mills、Stub roughing end mills、Dovetail milling cutters、Carbide slot drills、Carbide torus cutters、Angeled carbide end mills、Carbide torus cutters、Carbide ball-noseed slot drills、Mould cutter、Tool manufacturer.
Bewise Inc. www.tool-tool.com
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