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鍍膜技術發展歷程

鍍 膜 技 術 之 分 類

PVD沉積過程概念圖

PVD真空蒸鍍裝置

UBM鍍膜系統示意圖

鍍膜系統沈積原理

PVD蒸鍍技術比較
特性/技術 真空蒸鍍 濺鍍 離子鍍
薄膜材料 金屬 金屬,合金,化合物 金屬,合金,化合物
技術特點 真空蒸發 真空電漿法 真空電漿法
粒子能量(ev) 0.1~1 1~100 10~數千
沉積速率(m/min) 0.1~70 0.01~1.0 0.01~1.0
薄膜特點 密度普通 密度較高 密度較高,針孔少
附著性 一般 好 非常好
基板溫度(oc) 30-200 150-500 150-500
薄膜純度 與薄膜材料有關 與薄膜材料有關
與薄膜材料有關
複雜形狀基板附著能力 只鍍直射表面 只鍍直射表面和少部分非直射表面 能鍍所有表面且 厚度均勻

氮化鉻和硬鉻耐磨性之比較

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